| 000 | 00000nam c2200205 c 4500 | |
| 001 | 000046092472 | |
| 005 | 20221123174332 | |
| 007 | ta | |
| 008 | 210915s2021 ulkad 000c kor | |
| 020 | ▼a 9791166471070 ▼g 93500 | |
| 040 | ▼a 211009 ▼c 211009 ▼d 211009 | |
| 082 | 0 4 | ▼a 621.38152 ▼2 23 |
| 085 | ▼a 621.38152 ▼2 DDCK | |
| 090 | ▼a 621.38152 ▼b 2021z3 | |
| 245 | 0 0 | ▼a 반도체 제조기술의 이해 : ▼b 현장 최고 전문가들의 결정체 / ▼d 곽노열 [외]저 |
| 246 | 0 3 | ▼a 반도체 秘笈 전서 |
| 250 | ▼a 2판 | |
| 260 | ▼a 서울 : ▼b 한올출판사, ▼c 2021 | |
| 300 | ▼a xix, 699 p. : ▼b 천연색삽화, 도표 ; ▼c 26 cm | |
| 500 | ▼a 공저자: 배병욱, 오경택, 윤태균, 이성희, 임정훈, 정용우, 진수봉, 최호승, 홍기환 | |
| 700 | 1 | ▼a 곽노열, ▼g 郭魯悅, ▼d 1962-, ▼e 저 ▼0 AUTH(211009)147814 |
| 700 | 1 | ▼a 배병욱, ▼e 저 |
| 700 | 1 | ▼a 오경택, ▼e 저 |
| 700 | 1 | ▼a 윤태균, ▼e 저 |
| 700 | 1 | ▼a 이성희, ▼e 저 |
| 700 | 1 | ▼a 임정훈, ▼e 저 |
| 700 | 1 | ▼a 정용우, ▼e 저 |
| 700 | 1 | ▼a 진수봉, ▼e 저 |
| 700 | 1 | ▼a 최호승, ▼e 저 |
| 700 | 1 | ▼a 홍기환, ▼e 저 |
| 945 | ▼a KLPA |
소장정보
| No. | 소장처 | 청구기호 | 등록번호 | 도서상태 | 반납예정일 | 예약 | 서비스 |
|---|---|---|---|---|---|---|---|
| No. 1 | 소장처 과학도서관/Sci-Info(1층서고)/ | 청구기호 621.38152 2021z3 | 등록번호 121258094 (35회 대출) | 도서상태 대출가능 | 반납예정일 | 예약 | 서비스 |
| No. 2 | 소장처 과학도서관/Sci-Info(1층서고)/ | 청구기호 621.38152 2021z3 | 등록번호 121259904 (29회 대출) | 도서상태 대출중 | 반납예정일 2026-01-15 | 예약 | 서비스 |
| No. 3 | 소장처 세종학술정보원/과학기술실(5층)/ | 청구기호 621.38152 2021z3 | 등록번호 151361743 (12회 대출) | 도서상태 대출불가(자료실) | 반납예정일 | 예약 | 서비스 |
| No. | 소장처 | 청구기호 | 등록번호 | 도서상태 | 반납예정일 | 예약 | 서비스 |
|---|---|---|---|---|---|---|---|
| No. 1 | 소장처 과학도서관/Sci-Info(1층서고)/ | 청구기호 621.38152 2021z3 | 등록번호 121258094 (35회 대출) | 도서상태 대출가능 | 반납예정일 | 예약 | 서비스 |
| No. 2 | 소장처 과학도서관/Sci-Info(1층서고)/ | 청구기호 621.38152 2021z3 | 등록번호 121259904 (29회 대출) | 도서상태 대출중 | 반납예정일 2026-01-15 | 예약 | 서비스 |
| No. | 소장처 | 청구기호 | 등록번호 | 도서상태 | 반납예정일 | 예약 | 서비스 |
|---|---|---|---|---|---|---|---|
| No. 1 | 소장처 세종학술정보원/과학기술실(5층)/ | 청구기호 621.38152 2021z3 | 등록번호 151361743 (12회 대출) | 도서상태 대출불가(자료실) | 반납예정일 | 예약 | 서비스 |
컨텐츠정보
책소개
종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있다. 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각된다.
종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.
이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication,
반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들,
그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다.
다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.
정보제공 :
저자소개
곽노열(지은이)
한남대학교 건축공학과 교수
배병욱(지은이)
오경택(지은이)
윤태균(지은이)
이성희(지은이)
임정훈(지은이)
정용우(지은이)
진수봉(지은이)
최호승(지은이)
홍기환(지은이)
목차
01 반도체 개요 ● 반도체 제조기술 개요···················································5 01. 반도체 정의····································································· 7 ● 반도체란?···································································7 ● 반도체의 종류 ····························································8 02. 반도체 역사···································································· 9 ● 트랜지스터 ·································································9 ● 메모리 ···································································· 12 ● 세계 메모리 반도체 선도하는 대한민국·························· 15 03. 미래 메모리 반도체························································ 17 ● 메모리 시장······························································ 17 ● 기술적인 한계··························································· 18 ● PCRAM 제품·····························································20 ● ReRAM 제품 ····························································25 ● STT-MRAM 제품·······················································27 ● 요약········································································31 02 DRAM Memory 제품 01. DRAM Memory 소개·····················································37 ● DRAM이란? ·····························································37 ● DRAM 운용 제품별 특징·············································39 02. DRAM 기본 동작 소개···················································· 41 ● MOSFET·································································· 41 ● DRAM Architecture ··················································45 ● 주요 동작 소개··························································48 ● SWD, S/A 동작 이해···················································52 ● REFRESH ·······························································55 03. DRAM 주요 Process Module·········································57 ● ISO / GATE·······························································57 ● SAC·········································································59 ● SN·········································································· 61 ● MLM·······································································62 04. DRAM 변화 방향···························································64 ● DRAM Memory 기술 변화 요구···································64 03 NAND Memory 제품 01. NAND FLASH Memory 소개··········································73 ● FLASH Memory란?···················································73 ● FLASH Memory Market Trend···································· 76 02. NAND FLASH 기본 동작 소개·········································79 ● NAND Architecture···················································79 ● Erase/Read/Write Operation······································83 ● Cell의 형태 및 String 구조···········································93 ● ISPP········································································97 ● Cell 분포 및 Multi bit cell ···········································99 03. 3D NAND 구조 소개···················································· 103 ● 2D NAND와 3D NAND············································103 ● PUC 구조·······························································106 ● CTF·······································································107 ● Pipe와 Pipeless ······················································ 110 ● 3D NAND Process Sequence····································111 04. 3D NAND Key Process··············································· 115 ● PLUG···································································· 115 ● ONOP··································································· 119 ● SLIM····································································· 121 05. Future NAND FLASH Memory···································· 123 ● 3D Re-NAND·························································123 ● 3D Fe-NAND·························································124 ● SGVC····································································124 04 Diffusion_Furnace 공정 01. Diffusion 소개···························································· 131 ● Diffusion 정의·························································132 ● Diffusion 대표 공정 및 소재 소개································133 ● Diffusion 대표 장비 소개···········································137 02. Furnace공정 이해·······················································142 ● Diffusion공정 소개··················································142 ● Oxidation공정 소개·················································142 ● LPCVD·································································· 149 ● ALD공정································································160 03. Furnace 장비의 이해 ··················································· 170 ● Furnace 장비 소개··················································· 170 ● Batch 장비····························································· 171 ● Chamber 장비 소개················································· 179 04. 공정과 장비 관리 소개··················································186 ● 전산 시스템 활용 관리··············································186 ● PM········································································186 05. 미래 기술 해결 과제······················································188 05 Diffusion (Ion Implant) 01. Ion Implantation공정 개요··········································· 195 ● Ion Implantation공정의 역사와 정의··························· 195 ● Ion Implantation 관련 주요 공정································197 ● Ion Implantation공정의 주요 장비······························198 ● Ion Implantation 장비의 주요 구성·····························200 02. DRAM/NAND Ion Implantation Application·················200 ● Well Formation·······················································201 ● Threshold Adjust Implant·········································202 ● Source/Drain Implant··············································202 ● Lightly Doped Drain················································203 03. Ion Implantation 구성과 Hardware······························205 ● Gas 구성································································205 ● HW 기본 구성·························································208 04. Ion Implantation Physics············································ 217 ● Scattering 현상······················································· 218 ● Stopping Mechanism··············································· 218 ● Ion Projection Range···············································221 ● Channeling Effect···················································222 ● Shadowing Effect···················································224 ● Damage Engineering···············································225 ● Annealing······························································227 ● RTA 도입 및 특징·····················································228 ● 이온주입 후의 Monitoring 방법··································230 05. Ion Implantation 관련 미래 기술···································232 ● Cold & Hot Implantation··········································232 ● Plasma Doping·······················································233 ● Co Implantation······················································235 ● Advanced Anneal···················································237 06 Thinfilm_ CVD 공정 01. CVD공정 소개 ····························································245 ● CVD공정 정의·························································246 02. CVD공정의 역할 및 이해···············································248 ● 절연막 역할····························································248 ● Gap fill 특성····························································251 ● HARD MASK 역할···················································252 ● Low-k 절연막·························································253 03. CVD 제조 Fab 장비의 이해············································254 ● 장비 관리 특성························································255 ● 주요 부품 특성의 이해··············································257 04. CVD 주요 공정 장비의 소개···········································263 ● PE CVD USG공정····················································263 ● Thermal CVD BPSG공정··········································264 ● PE CVD ARC공정····················································266 ● HDP공정································································268 ● SOD공정································································271 ● PE Nitride공정························································273 ● ACL Hard Mask공정·················································273 ● Low-k공정·····························································275 ● NDC공정································································276 ● Gate ON Stack공정·················································277 05. CVD 장비 향후 Trends·················································278 07 Thinfilm_ PVD 공정 01. PVD공정····································································285 ● PVD공정 소개·························································285 02. PVD공정의 요구사항····················································286 03. Metal 물질의 특성·······················································286 ● Aluminum 물질·······················································287 ● Titanium 물질·························································287 ● Tungsten 물질························································288 ● Cobalt 물질····························································289 ● Tantalum 물질························································289 ● Copper 물질···························································290 04. PVD 주요 특성의 이해··················································290 ● Sheet Resistance····················································290 ● Contact Silicide 특성················································291 ● EM 현상·································································292 ● ALD 방식·······························································293 ● Damascene 구조·····················································293 05. PVD공정의 Fab 장비의 이해·········································294 ● Sputter공정 장비·····················································296 ● Contact Silicide·······················································300 ● ALD TiN 장비·························································302 ● CVD W 장비···························································304 ● LFW 장비·······························································307 ● EP Cu 장비·····························································309 ● Cu Barrier Metal 장비·············································· 312 06. PVD공정 향후 Trends·················································· 314 08 Photo 공정 01. Photo공정의 역할························································321 ● Photo공정 소개·······················································321 ● Photo Process의 이해··············································322 ● Photo 장비의 종류···················································324 ● Photo에 사용되는 소재·············································328 02. Photo공정·································································330 ● Imaging·································································330 ● Focus····································································336 ● Dose·····································································338 ● Leveling·································································339 ● Overlay··································································339 ● Alignment······························································ 341 ● Overlay··································································345 ● Overlay Control······················································348 ● MASK····································································353 ● Photo Resist···························································357 03. Photo 장비·································································363 ● Track·····································································363 ● Scanner·································································370 04. Photo공정 관리··························································377 ● Overlay··································································377 ● Incell·····································································379 ● CD········································································379 ● Defect···································································381 05. Photo 미래 기술··························································382 ● 차세대 Photo Graphy 기술········································382 ● EUV란···································································386 ● 기존 ArF와의 차이점················································387 ● EUV 기술의 문제점··················································388 09 Etch 공정 01. Etch 소개···································································397 ● 실생활에서 본 Etch Engineering 개요 ························397 02. Etch 기본···································································402 ● FAB공정과 반도체 소자············································402 ● Etch의 원리와 메커니즘············································408 ● 플라즈마 정의와 성질··············································· 413 ● Etch 고려사항························································· 419 ● Etch공정관리를 위한 결과물······································431 ● 식각 가스와 식각 물질 ·············································440 03. Etch 적용과 응용·························································444 ● Etch 대표 구조공정··················································444 ● Etch 장비 구성과 종류··············································454 ● Plasma Source에 따른 Etch 장비 구분························465 04. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476 ● 팹에서의 양산 기술·················································· 476 ● Etch 장비의 유지 관리··············································482 ● 양산에서 Etch가 가지는 어려움··································487 ● Etch 양산 엔지니어의 하루········································489 05. Etch Issue 및 향후 개발 방향········································490 ● 반도체 미세화 트렌트와 식각 이슈······························490 ● 기술적 한계 극복 방안과 기술 발전 방향······················492 10 Cleaning 공정 01. Cleaning공정······························································507 ● Cleaning공정 소개···················································507 02. Cleaning Chemical의 종류와 특징 ································ 511 ● SPM 세정······························································· 511 ● APM 세정······························································· 514 ● DHF / BOE 세정······················································ 517 ● H3PO4, Phosphoric Acid 세정····································520 ● Ozone 세정 ···························································521 ● NFAM 세정····························································525 ● Function Water 세정················································527 ● HF/NH3 Gas 건식 세정·············································531 03. Cleaning 장비의 종류와 특징 ········································534 ● Batch Type····························································534 ● Wet Single Type·····················································537 ● Dry Single Type······················································539 ● Scrubber 세정························································542 04. Cleaning공정의 품질 관리와 생산장비 관리····················544 ● defect ··································································544 ● Uniformity ····························································546 ● Contamination ·······················································548 ● Fume····································································548 ● Cross contamination···············································550 ● Selectivity······························································552 ● Leaning·································································553 ● Flow Rate······························································555 ● Temperature··························································557 ● Concentration ·······················································559 ● Exhaust ······························································· 561 ● Pressure ·······························································563 05. Cleaning의 미래기술 ····················································565 11 CMP 공정 01. CMP공정 소개·····························································573 02. CMP공정의 종류와 특징···············································578 ● Planarization··························································578 ● Isolation·································································580 03. CMP 장비의 구성과 특징··············································582 ● Polisher·································································582 ● Cleaner··································································584 ● EPD······································································587 04. CMP공정의 품질 관리와 생산 장비 관리··························591 ● Defect, Scratch·······················································591 ● Uniformity, APC······················································594 ● Slurry ···································································596 ● Selectivity······························································599 ● Dishing, Erosion······················································600 ● Pad ······································································602 ● Disk ······································································604 ● Membrane·····························································605 ● Retainer Ring ·························································609 ● Brush ··································································· 610 ● Filter ·····································································611 05. CMP의 미래 기술 ························································ 613 12 MI (Metrology & Inspection) 01. Metrology ·································································621 ● Metrology 개론·······················································621 ● Device 박막 두께 측정··············································621 ● Device 구조/형태 측정·············································626 ● 박막 조성/물성 측정·················································631 ● 휨 측정··································································638 02. Inspection·································································639 ● Inspection 개론·······················································639 ● BF/DF 검사·····························································640 ● 파티클 카운터·························································643 ● 매크로 검사····························································645 ● 전자빔 검사····························································645 03. 공정 계측 응용기술······················································648 ● 가상계측································································648 ● 측정 검사 기술 동향과 미래······································649 13 반도체 용어해설 반도체 용어해설·································································656