Handbook of plasma processing technology: fundamentals, etching, deposition, and surface interactions
| 000 | 02911camuuu200325 a 4500 | |
| 001 | 000000620077 | |
| 005 | 19981203110740.0 | |
| 008 | 890809s1990 njua b 001 0 eng | |
| 010 | ▼a 89022834 | |
| 020 | ▼a 0815512201 : ▼c $86.00 | |
| 040 | ▼a DLC ▼c DLC ▼d PMC | |
| 049 | 1 | ▼l 421101696 ▼f 과학 |
| 050 | 0 0 | ▼a TA2020 ▼b .H37 1990 |
| 082 | 0 0 | ▼a 621.044 ▼2 19 |
| 090 | ▼a 621.044 ▼b H236 | |
| 245 | 0 0 | ▼a Handbook of plasma processing technology: ▼b fundamentals, etching, deposition, and surface interactions / ▼c edited by Stephen M. Rossnagel, Jerome J. Cuomo, William D. Westwood. |
| 260 | ▼a Park Ridge, N.J., U.S.A. : ▼b Noyes Publications , ▼c c1990. | |
| 300 | ▼a xxiii, 523 p. : ▼b ill. ; ▼c 25 cm. | |
| 440 | 0 | ▼a Materials science and process technology series. |
| 504 | ▼a Includes bibliographical references. | |
| 505 | 2 | ▼a Techniques for IC processing / David B. Fraser and William D. Westwood -- Introduction to plasma concepts and discharge configurations / Joseph L. Cecchi -- Fundamentals of sputtering and reflection / David N. Ruzic -- Bombardment-induced compositional change with alloys, oxides, oxysalts, and halides / Roger Kelly -- RF diode sputter etching and deposition / Joseph S. Logan -- Magnetron plasma deposition processes / Stephen M. Rossnagel -- Broad-beam ion sources / Harold R. Kaufman and Raymond S. Robinson -- Reactive ion etching / Gottlieb S. Oehrlein -- Reactive sputter deposition / William D. Westwood -- Plasma enhanced chemical vapor deposition of thin films for microelectronics / Rafael Reif -- Electron cyclotron resonance microwave discharges for etching and thin film deposition / Jes Asmussen. |
| 505 | 2 | ▼a Hollow cathode etching and deposition / Chris M. Horwitz -- Ion platting / Donald M. Mattox -- Ionized cluster beam (ICB) deposition techniques / Isao Yamada -- The activated reactive evaporation (ARE) process / Chandra V. Deshpandey and Rointan F. Bunshah -- Formation of thin films by remote plasma enhanced chemical vapor deposition (Remote PECVD) / Gerold Lucovsky, David V. Tsu and Robert J. Markunas -- Selective bias sputter deposition / Soren Berg and Claes Nender -- Formation of thin films by remote plasma enhanced chemical vapor deposition (Remote PECVD) / Gerold Lucovsky, David V. Tsu and Robert J. Markunas -- Selective bias sputter deposition / Soren Berg and Claes Nender -- Vacuum arc-based processing / David Sanders -- Ion-surface interactions : general understandings / Russell Messier, Joseph E. Yehoda and Lawrence J. Pilione -- Ion assisted deposition / James J. McNally. |
| 505 | 2 | ▼a Microstructural control of plasma-sputtered refractory coatings / David M. Hoffman and Robert C. McCune. |
| 650 | 0 | ▼a Plasma engineering. |
| 650 | 0 | ▼a Semiconductors ▼x Etching. |
| 650 | 0 | ▼a Plasma etching. |
| 700 | 1 | ▼a Rossnagel, Stephen M. |
| 700 | 1 | ▼a Cuomo, J. J. |
| 700 | 1 | ▼a Westwood, William D. ▼q (William Dickson) ▼d 1937-. |
Holdings Information
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| No. 1 | Location Science & Engineering Library/Sci-Info(Stacks2)/ | Call Number 621.044 H236 | Accession No. 421101696 (12회 대출) | Availability Available | Due Date | Make a Reservation | Service |
Contents information
Book Introduction
Plasma processing currently provides the most practical way to carry out many of the process steps involved in integrated circuitry. This overviews of the technology describes the advantages provided by plasmas, plasma fundamentals, and a range of plasma processes relevant to the deposition and etching of thin films for microelectronics and other fields. Annotation copyright Book News, Inc. Portland, Or.
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Table of Contents
Techniques for IC Processing
Introduction to Plasma Concepts and Discharge Configurations
Fundamentals of Sputtering and Reflection
Bombardment-Induced Compositional Changes with Alloys, Oxides, Oxysalts, and Halides
RF Diode Sputter Etching and Deposition
Magnetron Plasma Deposition Processes
Broad-Beam Ion Source
Reactive Ion Etching
Reactive Sputter Deposition
Plasma Enhanced Chemical Vapor Deposition of Thin Films for Microelectronics
Electron Cyclotron Resonance Microwave Discharges for Etching and Thin Film Deposition
Hollow Cathode Etching and Deposition
Ion Plating
Ionized Cluster Beam (ICB) Deposition Techniques
The Activated Reactive Evaporation (ARE) Process
Formation of Thim Films by Remote Plasma Enhanced Chemical Vapor Deposition (Remote PECVD)
Selective Bias Sputter Deposition
Vacuum Arc-Based Processing
Ion Source Interactions: General Understandings
Ion Assisted Deposition
Microstructural Control of Plasma-Sputtered Refractory Coatings
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