| 000 | 00827camuuu200241 a 4500 | |
| 001 | 000000920462 | |
| 005 | 19990112143537.0 | |
| 008 | 931118s1994 njua b 001 0 eng | |
| 010 | ▼a 93042135 | |
| 020 | ▼a 0780310551 | |
| 040 | ▼a DLC ▼c DLC ▼d DLC ▼d 244002 | |
| 049 | 0 | ▼l 151007137 |
| 050 | 0 0 | ▼a TA2020 ▼b .G75 1994 |
| 082 | 0 0 | ▼a 621.044 ▼2 20 |
| 090 | ▼a 621.044 ▼b G858c | |
| 100 | 1 | ▼a Grill, Alfred. |
| 245 | 1 0 | ▼a Cold plasma in materials fabrication : ▼b from fundamentals to applications / ▼c Alfred Grill. |
| 260 | ▼a Piscataway, NJ : ▼b IEEE Press ; ▼a New York : ▼b Institute of Electrical and Electronics Engineers, ▼c c1994. | |
| 300 | ▼a xiii, 257 p. : ▼b ill. ; ▼c 24 cm. | |
| 504 | ▼a Includes bibliographical references and index. | |
| 650 | 0 | ▼a Plasma engineering. |
| 650 | 0 | ▼a Low temperature plasmas. |
| 650 | 0 | ▼a Manufacturing processes. |
Holdings Information
| No. | Location | Call Number | Accession No. | Availability | Due Date | Make a Reservation | Service |
|---|---|---|---|---|---|---|---|
| No. 1 | Location Sejong Academic Information Center/Science & Technology/ | Call Number 621.044 G858c | Accession No. 151007137 (5회 대출) | Availability Loan can not(reference room) | Due Date | Make a Reservation | Service |
Contents information
Book Introduction
Cold plasma research and development activities, as well as its applications in materials processing have grown enormously in the past decade. Cold Plasma in Materials Fabrication is a comprehensive, up-to-date monograph which presents all aspects of cold, low-pressure plasmas.
The eight extensive chapters in this book cover the following topics:
- The main parameters and classifications of different types of plasma
- Reactions within cold plasmas and between cold plasmas and solid surfaces
- State-of-the-art methods for generation and diagnostics of cold plasmas and their application for processing of materials
Information Provided By: :
Author Introduction
Alfred Grill(지은이)
<공정플라즈마 기초와 응용>
Table of Contents
CONTENTS PREFACE = xi LIST OF SYMBOLS = xiii 1 FUNDAMENTALS OF PLASMA = 1 1.1 Introduction = 1 1.2 Definition of Plasma = 2 1.3 Plasma Parameters = 5 1.3.1 The Degree of Ionization = 6 1.3.2 Plasma Temperature = 7 1.3.3 Debye Length = 12 1.3.4 Plasma Sheath = 13 1.3.5 Plasma Frequency = 16 1.4. Conditions for Plasma Existence = 17 1.5 Diffusion of Charged Particles in Plasma = 17 1.6 Plasma Types = 20 1.6.1 Thermal Plasmas = 21 1.6.2 Cold Plasmas = 21 1.7 Questions = 22 1.8 References = 23 2 COLD PLASMA GENERATION = 24 2.1 DC Glow Discharges = 24 2.1.1 Paschen's Law = 27 2.1.2 Characteristics of DC Glow Discharge = 28 2.2 Radio Frequency Discharges = 31 2.2.1 Self-bias in RF Plasmas = 35 2.2.2 RF Versus DC Plasmas = 38 2.3 Microwave Plasmas = 39 2.4 Electron Cyclotron Resonance Plasmas = 40 2.4.1 Advantages of ECR Plasmas = 43 2.5 Questions = 43 2.6 References = 44 3 PLASMA CHEMISTRY = 46 3.1 Introduction = 46 3.2 Definitions of Terms = 47 3.3 Chemical Reactions = 48 3.3.1 Homogeneous Reactions = 49 3.3.2. Heterogeneous Reactions = 62 3.4 The Chemical Reaction Chain = 65 3.5 Plasma Surface Interactions = 68 3.5.1 Ion and Electron Induced Chemical Reactions = 74 3.5.2 Energy Transfer = 78 3.5.3 Effects on Film Growth = 79 3.5.4 Plasma Induced Damage = 80 3.6 Questions = 83 3.7 References = 83 4 PLASMA REACTORS = 86 4.1 Plasma Systems = 86 4.1.1 Process Parameters = 87 4.1.2 Scale-up = 90 4.2 DC Reactors = 93 4.3 RF Reactors = 93 4.3.1 Electrodeless Discharges = 94 4.3.2 RF Discharges with Electrodes = 96 4.3.3 High-Density RF Reactors = 99 4.4 Microwave Reactors = 101 4.5 ECR Reactors = 104 4.6 Magnetically Enhanced Reactors = 107 4.7 Remote PECVD Reactors = 109 4.8 Reactor Clusters = 110 4.9 Questions = 111 4.10 References = 112 5 PLASMA DIAGNOSTICS = 114 5.1 Mass Spectrometry = 115 5.1.1 The Quadrupole Mass Spectrometer = 115 5.1.2 Plasma Analysis = 123 5.1.3 Summary = 127 5.2 Electrostatic Probes = 129 5.2.1 Probe Characteristics = 131 5.2.2 Probe Analysis = 133 5.3 Optical Methods = 137 5.3.1 Optical Emission Spectrometry = 138 5.3.2 Absorption Spectroscopy = 144 5.3.3 Laser Induced Fluorescence = 144 5.3.4 Summary = 146 5.4 Questions = 147 5.5 References = 148 6 COLD PLASMA PROCESSES FOR SURFACE MODIFICATION = 151 6.1 Introduction = 151 6.2 Surface Modification of Polymers = 153 6.3 Surface Cleaning and Ashing = 160 6.3.1 Cleaning = 160 6.3.2 Ashing = 163 6.4 Oxidation = 166 6.5 Surface Hardening = 170 6.5.1 Nitriding = 170 6.5.2 Carburizing = 175 6.5.3 Boriding = 176 6.6 Questions = 176 6.7 References = 176 7 DEPOSITION OF COATINGS BY PECVD = 180 7.1 Deposition of Organic Films = 180 7.1.1 Plasma Polymerization = 180 7.1.2 Polymerization Mechanisms = 183 7.1.3 Plasma Polymerization Parameters = 186 7.1.4 Examples of Plasma Polymerization = 189 7.2 Deposition of Inorganic Films = 191 7.2.1 Amorphous Hydrogenated Silicon = 192 7.2.2 Silicon Nitride = 195 7.2.3 Silicon Dioxide = 201 7.2.4 Silicon Carbide = 202 7.2.5 Diamondlike Carbon = 204 7.2.6 Diamond = 207 7.3 Questions = 209 7.4 References = 210 8 PLASMA ASSISTED ETCHING = 216 8.1 Introduction = 216 8.2 Plasma Etching = 219 8.2.1 Mechanisms of Plasma Etching = 220 8.2.2 Loading Effects = 221 8.3 Reactive Ion Etching = 223 8.3.1 Mechanisms of RIE = 224 8.3.2 Anisotropy = 225 8.3.3 Selectivity = 228 8.4 Etching of Specific Materials = 230 8.4.1 Semiconductors = 231 8.4.2 Metals = 235 8.4.3 Polymers = 237 8.5 Etching Induced Damage = 241 8.6 Questions = 242 8.7 References = 243 INDEX = 247 ABOUT THE AUTHOR = 257